ct micro rev 0 (preliminary) proprietary & confidential page 1 feb , 201 4 irp 3012v2 4 - e5 smd type 94 0nm infrared emitter package outline schematic features ? sma ll double - end package ? viewing angle at x axis (note3) = ? 22.5 0 ? high reliability ? good spectral matching to si photo detector ? rohs compliance applications ? i nfrared sensor ? infrared touch panel solutions description the irp 3012v2 4 - e5 is a ga al as infrared led housed in a miniature smd package . the device has a peak wavelength of 940nm led spectral ly matched with phototransistor or photodiode . cathode anode
ct micro rev 0 (preliminary) proprietary & confidential page 2 feb , 201 4 irp 3012v2 4 - e5 smd type 94 0nm infrared emitter absolute maximum rating at 25 0 c symbol parameters ratings units notes i f continuous forward current 7 0 ma i fp peak forward current 0. 7 a 1 v r reverse voltage 5 v t opr operating te mperature - 40 ~ +85 0 c t stg storage temperature - 40 ~ +100 0 c t sol soldering temperature 260 0 c 2 p d power dissipation at(or below) 25 free air temperature 119 mw r thja junction to ambient thermal resistance 540 0 c/w electro - optical characteristics ta = 25c (unless otherwise specified) optical characteristics symbol parameters test conditions min typ max units notes ie radiant intensity i f =20ma 3.5 4.65 - mw/sr i f = 70 ma - 16.0 - p peak wavelength i f =20ma - 940 - nm ? spectral bandwidth i f =20ma - 3 0 - nm 1/2 angle of half intensity (x) i f =20ma - ? 22.5 - deg 3 angle of half intensity (y) ? 2 0 electrical characteristics symbol parameter s test conditions min typ max units notes v f forward voltage i f =20ma 1.0 1.2 5 1.5 v i f =70 ma 1.1 1.38 1.7 i r reverse current v r =5v - - 10 a notes: 1: i fp conditions -- pulse width Q 100s and duty Q 1%. 2: soldering time Q 5 seconds. 3 : test condition :
ct micro rev 0 (preliminary) proprietary & confidential page 3 feb , 201 4 irp 3012v2 4 - e5 smd type 94 0nm infrared emitter typical ch aracteristic curves
ct micro rev 0 (preliminary) proprietary & confidential page 4 feb , 201 4 irp 3012v2 4 - e5 smd type 94 0nm infrared emitter typical characteristic curves
ct micro rev 0 (preliminary) proprietary & confidential page 5 feb , 201 4 irp 3012v2 4 - e5 smd type 94 0nm infrared emitter package dimension all dimensions are in mm, unless otherwise stated recommended soldering mask all dimensions are in mm, unless otherwise st ated ordering information p art number description quantity irp 3012v2 4 - e5 tape & reel 2 000 pcs
ct micro rev 0 (preliminary) proprietary & confidential page 6 feb , 201 4 irp 3012v2 4 - e5 smd type 94 0nm infrared emitter reel dimension all dimensions are in mm, unless otherwise stated tape dimension all dimensions are in mm, unless otherwise stated
ct micro rev 0 (preliminary) proprietary & confidential page 7 feb , 201 4 irp 3012v2 4 - e5 smd type 94 0nm infrared emitter reflow pro file profile feature pb - free assembly profile temperature min. (tsmin) 150c temperature max. (tsmax) 200c time (ts) from (tsmin to tsmax) 60 - 120 seconds ramp - up rate (t l to t p ) 3c/second max. liquidous temperature (t l ) 217c time (t l ) maintained above (t l ) 60 C 150 seconds peak body package temperature 260c +0c / - 5c time (t p ) within 5c of 260c 30 seconds ramp - down rate (t p to t l ) 6c/second max time 25c to peak temperature 8 minutes max.
ct micro rev 0 (preliminary) proprietary & confidential page 8 feb , 201 4 irp 3012v2 4 - e5 smd type 94 0nm infrared emitter disclaimer ct micro reserves the right to make changes without further notice to any products herein to improve reliability, function or design. ct micro does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it con vey any license under its patent rights, nor the rights of others. ______________________________________________________________________________________ ct micro are not authorized for use as critical components in life support devices or systems without express written approval of ct micro international corp oration . 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when proper ly used in accordance with instruction for use provided in the label l ing, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reaso nably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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